Due to the small size of some PCB Board , PCB factories often opt for panelization during the manufacturing process. Panelization can improve efficiency in the assembly process, reduce material waste, and lower costs. However, several important considerations should be taken into account when designing PCB Board panelization.
- PCB Board Panelization Shape: The panelization shape should be as close to a rectangle as possible. Recommended panelization options include 2×3, 3×5, and so on.
- PCB Board Panelization Size: The panel size should be controlled within the dimensions of width × length ≤ 280 mm × 300 mm. If automatic dispensing is required, the panel size should be ≤ 125 mm × 180 mm.
- V-CUT Groove: After creating V-CUT grooves, the remaining thickness X should be between 1/4 to 1/3 of the board thickness, with a minimum value of 0.4 mm. For boards with heavy loads, the upper limit can be considered, while the lower limit can be used for lighter boards.
- Misalignment of V-CUT Groove: The misalignment S between the upper and lower sides of the V-CUT groove should be less than 0.1 mm. For boards with a thickness smaller than 1.2 mm, V-CUT panelization should be avoided due to the minimum remaining thickness requirement.
- Positioning Reference Points: When setting positioning reference points, a non-solder mask area larger than the reference point by 1.5 mm should be left around it.
- Clearance around Connection Points: There should be no large or protruding components near the connections between the panel’s outer frame and inner small boards, as well as between the small boards themselves. Components should also be placed at least 0.5 mm away from the edge of the PCB to ensure proper functioning of cutting tools.
- Corner Positioning Holes: Four positioning holes with a diameter of 4 mm ± 0.01 mm should be opened at the four corners of the panelization outer frame.
- Positioning Holes for Each Small Board: Each small board within the panelization should have at least three positioning holes with a diameter of 3 mm to 6 mm. No traces or components should be placed within 1 mm of the edge positioning holes.
- Symbol Placement for PCB Whole Board Positioning and Fine-Pitch Device Positioning: For QFPs with a spacing smaller than 0.65 mm, their diagonal positions should be used for positioning symbols. Symbols for panelized PCB sub-boards should be used in pairs and placed at the diagonal corners of the positioning elements.
- Larger Components: Larger components such as I/O interfaces, microphones, battery connectors, tactile switches, headphone jacks, and motors should have positioning pillars or holes.
In the PCB Board panelization process, considering factors such as component layout, heat dissipation design, separation of ground and signal lines, soldering quality, and packaging and labeling can significantly improve the stability and reliability of the circuit board. Additionally, it is advisable to conduct thorough simulations and testing before the design stage to identify potential issues and optimize the layout.
