CAPABILITY
Rigid PCB&HDI PCB
Flex PCB
Key Production Equipment
Key Test Equipment
Reliability Test Project
Rigid PCB&HDI PCB
| Item | Capacity |
| Layer Count | 1-24 Layers |
| Material Type | FR-4, FR-1、CEM-1、CEM-3、XPC、22F、High TG、Halogen Free |
| Material Brand | Shengyi,TUC,NANYA,MATSUSHITA,Isola,Rogers,Taconic,Arlon,KB,Self-provided,etc. |
| Maximum Panel Size | 520 × 620mm |
| Board Thickness | 0.3-3.5mm |
| Copper Thickness | 1/3 OZ, H/H OZ, 1/1 OZ, 2/2OZ, 3/3OZ, 4/4OZ |
| Layer To Layer Registration Tolerance | ±0.05mm |
| Max. Drill Aspect Ratio | 10:01 |
| Min. Impedance Tolerance | ±8% |
| Drilling | Through Hole,Blind Via,Buried Via,Semi-hole |
| Min./Max. Hole Size | 0.02mm/6.5mm |
| Min. Line Width/Spacing | 0.075/0.075mm |
| Tolerance | Special Dimension Control:±0.05mm |
| NPTH:±0.05mm | |
| PTH:±0.075mm | |
| V-Cut:±0.01mm | |
| Surface Treatment | OSP、HAL/LFHAL、Flash Gold、ENIG、Immersion Tin、Immersion Silver、Flux、Gold Finger（Gold Plating） |
Flex PCB
| Item | Capacity |
| Layer Count | 1-10 Layers |
| Board Thickness | 0.05mm-0.8mm |
| Copper Thickness | 1/3oz – 2oz |
| Min. Line Width/Spacing | 3mil/3mil |
| Minimum Hole Diameter | 8mil |
| Minimum Size for Hole Ring | 3.2mil |
| Hole to Hole Distance | 10mil |
| Min. Impedance Tolerance | ±10% |
| Solder Mask Registration | ±3mil |
| Min Solder Mask Bridge | Sample:0.06mm Big Volume：0.075mm |
| Solder Mask Color | Green，Blue，Yellow，Black |
| Silkscreen Line Width | 5mil |
| Surface Treatment | HASL、ENIG、ENEPIG、Immersion Silver、OSP、Immersion Tin |
Key Production Equipment
| Equipment | Specification | Vendor | Quantity |
| Drilling Machine | HANS-F6MH | Han’s MP | 12 |
| Auto Edge Beveling Machine | / | Zhongshan Lianyi | 1 |
| Auto Dry Film Laminator | UTBD-705465 | Shenzhen CK | 3 |
| UV Exposure Machine | 5KW/7KW | Taiwan | 6 |
| Out layer Line | SI-N640 | Sanging | 2 |
| Develop Line | / | Luxshare | 4 |
| Auto Screen Printing Machine | MF6080PSR | Miaohui | 14 |
| Legend Printer | / | Lianxing | 12 |
| Precision Hot-Air Oven | UT0D-27D | Shenzhen CK | 8 |
| Plating Line | MV-III | Masterview | 1 |
| SEC Line | SCEC-5088 | Eastspacelight | 1 |
| Panel Plating Line | / | Yisheng | 1 |
| Pattern Plating Line | / | Sanwa | 1 |
| Collimated UV Exposure Machine | / | Zhongxin | 1 |
| OSP Line | LX-04-09 | Luxshare | 1 |
| Clearing Board Line | / | Luxshare | 2 |
| Etching Line | LX | Luxshare | 2 |
| X-ray Drilling Machine | / | Taliang | 8 |
| Routing Machine | 1007 | Shunlong | 6 |
| Auto Beveling Machine | QBI | Caiguang | 1 |
| Auto V-scoring Machine | VC-360/460 | Caiguang | 4 |
| Pattern Plating Line | / | Sanwa | 1 |
Key Test Equipment
| No. | Equipment | Vendor | Quantity | Picture |
| 1 | Flying Probe Tester | KeHuiLong | 6 | |
| 2 | Automatic testing machine | KeHuiLong | 7 | |
| 3 | Semi-automatic testing machine | KeHuiLong | 10 | |
| 4 | Peel strength tester | AISIDA | 1 |  |
| 5 | Insulation withstand voltage summation tester | WEIMU | 1 |  |
| 6 | Reflow Oven | TianYueJia | 1 |  |
| 7 | High and low temperature handover damp heat test chamber | Handi | 1 |  |
| 8 | Digital ultra-high resistance micro-current measuring instrument | Huahuijing | 1 | |
| 9 | Impedance tester | Yike | 1 |  |
| 10 | UV spectrophotometer | Jingke | 1 |  |
| 11 | Microscope | Digitophk | 1 |  |
| 12 | Slice sample polishing machine | Huihua | 1 | |
| 13 | PH meter | ZhengYe | 1 | |
| 14 | Copper thickness gauge | CMI700 | 1 | |
| 15 | Energy dispersive X-ray fluorescence spectrometer | SinDin | 1 |  |
Reliability Test Project
| Test Program | Purpose | Testing standards/requirements |
| Weldability experiment | Wettability | IPC-TM-650 3.10 |
| Tape tension test | Solder resistance adhesion | IPC-TM-650 2.4.1 & 2.4.28 |
| Peel strength testing | Copper foil adhesion | IPC-TM-650 2.4.8.5 |
| Ion pollution testing | Surface cleanliness | IPC-TM-650 2.3.25 & 2.3.26 |
| Bending/bending tester | Plate warpage | IPC-TM-650 2.4.22B |
| Microsection | Gold and nickel thickness | Customer standard |
| X-Ray Test | Copper, gold, and nickel thickness | Customer standard |
| CMI X-Ray Test | Copper thickness | Customer standard |
| Electrical Test | Open/short circuit | 300V <50Ω |
| Impedance tester | Impedance value | Customer standard |
| High voltage testing | Insulation | 2000V |
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